Technical Specifications:
Essentials:
Capacity: 512 GB
Status: Launched
Launch Date: 03'18
Lithography Type: 3D2 QLC
Use Conditions: PC/Client/Tablet
Performance:
Sequential Read (up to): 1500 MB/s
Sequential Write (up to): 1000 MB/s
Random Read (8GB Span) (up to): 90000 IOPS
Random Write (8GB Span) (up to): 220000 IOPS
Power - Active: 0.1 W
Power - Idle: 0.040W
Reliability:
Vibration - Operating: 2.17 GRMS
Vibration - Non-Operating: 3.13 GRMS
Shock (Operating and Non-Operating): 1000 G
Operating Temperature Range: 0°C to 70°C
Endurance Rating (Lifetime Writes): 100 TBW
Mean Time Between Failures (MTBF): >= 1.6 million hours
Uncorrectable Bit Error Rate (UBER): <1 sector per 10^15 bits read
Package Specifications:
Weight: <10 grams
Form Factor: M.2 22 x 80mm
Interface: PCIe NVMe 3.0 x4
Advanced Technologies:
Enhanced Power Loss Data Protection: No
Hardware Encryption: AES 256 bit
High Endurance Technology (HET): No
Temperature Monitoring and Logging: No
End-to-End Data Protection: Yes
Intel® Smart Response Technology: Yes
Intel® Remote Secure Erase: No
Intel® Rapid Start Technology: Yes